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| 1 motorola sensor device data ! " #$% % " % % ! motorola?s MPXH6400A series sensor integrates on?chip, bipolar op amp circuitry and thin film resistor networks to provide a hi gh output signal and temperature compensation. the small form factor and high reliability of on?chip integration make the motorola pressure sensor a logical and economical choice for the system designer. the MPXH6400A series piezoresistive transducer is a state?of?the?art, monolithic, signal conditioned, silicon pressure sensor. this sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. features ? improved accuracy at high temperature ? available in small and super small outline packages ? 1.5% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller?based systems ? temperature compensated from ?40 to +125 c ? durable thermoplastic (pps) surface mount package application examples ? industrial controls ? engine control/manifold absolute pressure (map) figure 1. fully integrated pressure sensor schematic order this document by MPXH6400A ## #& semiconductor technical data ? motorola, inc. 2003 integrated pressure sensor 20 to 400 kpa (3.0 to 58 psi) 0.2 to 4.8 volts output (3.0 to 58 psi) pin number note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is denoted by the chamfered corner of the package. 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c MPXH6400A6t1 case 1317 MPXH6400Ac6t1 case 1317a 4v out 8 n/c super small outline package rev 0 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (1) parametrics symbol value units maximum pressure (p1 p2) p max 1600 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c output source current @ full scale output (2) i o + 0.5 madc output sink current @ minimum pressure offset (2) i o ? ?0.5 madc notes: 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. maximum output current is controlled by effective impedance from v out to gnd or v out to v s in the application circuit. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 p2.) characteristic symbol min typ max unit pressure range p op 20 ? 400 kpa supply voltage (1) v s 4.64 5.0 5.36 vdc supply current i o ? 6.0 10 madc minimum pressure offset (2) (0 to 85 c) @ v s = 5.0 volts v off 0.133 0.2 0.267 vdc full scale output (3) (0 to 85 c) @ v s = 5.0 volts v fso 4.733 4.8 4.866 vdc full scale span (4) (0 to 85 c) @ v s = 5.0 volts v fss 4.467 4.6 4.733 vdc accuracy (5) (0 to 85 c) ? ? ? 1.5 %v fss sensitivity v/p ? 12.1 ? mv/kpa response time (6) t r ? 1.0 ? ms warm?up time (7) ? ? 20 ? ms offset stability (8) ? ? 0.25 ? %v fss notes: 1. device is ratiometric within this specified excitation range. 2. offset (v off ) is defined as the output voltage at the minimum rated pressure. 3. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 4. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. warm?up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. offset stability is the product?s output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data figure 2. cross sectional diagram ssop (not to scale) figure 3. typical application circuit (output source current operation) ! ! ! v s "# $% "#& "#' %%# ( ' ) figure 2 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 1317). figure 3 shows a typical application circuit (output source current operation). * + ,- $% '$ '$% &$ &$% ./,, ./*./01 ,/2+/3425 6-"#72 8 % '% % % %% % '% % % %% % '% % % &%% &% &'% & % $ $% $ $% %$ % & % figure 4. output versus absolute pressure 1 9 , :*%$%%':;%$%% '- .. . 9 $%35 9% '%% figure 4 shows the sensor output signal relative to pres- sure input. typical minimum and maximum output curves are shown for operation over 0 to 85 c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the s ilicon diaphragm. the MPXH6400A series pressure sensor operating characteris- tics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long?term reliability. contact the factory for information re- garding media compatibility in your application. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data transfer function (MPXH6400A) nominal transfer value: v out = v s x (0.002421 x p ? 0.00842) (pressure error x temp. factor x 0.002421 x v s ) v s = 5.0 0.36 vdc temperature error band MPXH6400A series !./27 "# , ;'% & % $ /6)/.2 ./"# '$% &$% $% %$% $% ;'% ;% % % '% % '% % %% % /6)/.2 ./ .. . 25 . note: the temperature multiplier is a linear response from 0 c to ?40 c and from 85 c to 125 c pressure error band .. ."6" ,0 ../,, ./ &$% $% $% ;$% ;<$% ;'$% %$% % ./,, ./*"#72- ./,, ./.. .*72- ./,, ./ .. .*2=- % '%%*72- < $ *72- '% % '$% ;<&$% % %% % '% % < $ *72- % %% % '% % % &%% &% &'% & % & % '%% ; $% ; $% $% $% ordering information ? super small outline package device type options case no. mpx series order no. packing options marking basic element absolute, element only 1317 MPXH6400A6u rails MPXH6400A absolute, element only 1317 MPXH6400A6t1 tape and reel MPXH6400A ported element absolute, axial port 1317a MPXH6400Ac6u rails MPXH6400A absolute, axial port 1317a MPXH6400Ac6t1 tape and reel MPXH6400A f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data surface mounting information minimum recommended footprint for super small outline packages surface mount board layout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct pad geometry, the packages will self?align when subjected to a solder reflow process. it is always recommended to fabri- cate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. ssop footprint (case 1317 and 1317a) %$% 8 %$ > %$% & 8 $& "#5? 66 %$& >$ & %$ % &$ %$% % $ f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data super small outline package dimensions case 1317?03 issue b 0.025 0.298 0.050 %$%%' ! 0.165 0.280 a b c 1 $ $ $ '$ ;>>'$ &$ $ 8 $%% $ '$ ! 8$ $ ! $ ! ! !$%% 8$ %$%%' %$%% ! detail e 0.023 0.010 .010 0.014 detail e 0.019 0.300 0.280 0.300 0.400 0.420 3 5 0.278 0.145 0.002 0.013 10 0 3 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data super small outline package dimensions (continued) case 1317a?01 issue a 0.025 0.130 0.050 %$%%' ! 0.390 0.325 a b c 1 $ $ $ '$ ;>>'$ &$ $ 8 $%% $ '$ ! 8$ $ ! $ ! ! !$%% 8$ %$%%' %$%% ! detail e 0.048 0.010 .014 0.014 detail e 0.018 0.345 0.325 0.345 0.400 0.420 5 0.110 0.370 0.002 0.038 10 0 0.200 0.180 0.280 a b 0.300 0.280 0.300 3 3 bottom view f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 8 motorola sensor device data information in this document is provided solely to enable system and software implementers to use motorola products. there are no express or i mplied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in th is document. motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represen tation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the applicati on or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? param eters that may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all oper ating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical impl ant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer s hall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expens es, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and the stylized m logo are registered in the us patent and t rademark office. all other product or service names are the proper ty of their respective owners. motorola, inc. is an equal opportunity/affirmative action employer. motorola inc. 2003 how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 1?800?521?6274 or 480?768?2130 japan : motorola japan ltd.; sps, technical information center, 3?20?1, minami?az abu, minato?ku, tokyo 106?8573, japan. 8 1?3?3440?3569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 da i king street, tai po industrial estate, tai po, n.t., hong ko ng. 852?26668334 home page : http://motorola.com/semiconductors MPXH6400A f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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